iNPACK
Advanced Packaging Solutions
iNPACK is an advanced heterogeneous integration provider of System-in-Package (SiP) solutions.
iNPACK’s expert offering includes an organic substrate and enhanced micro-electronics packaging technologies maximizing functionality, speed & efficiency in a reduced form factor.
Our All-in-One approach benefits our customers with SMT, substrate design and manufacturing, process design, testing, and excellent supply chain services. All under the same roof.
System In Package is being applied in a variety of market industries such as automotive, defense, aerospace, medical electronics, energy, and communication, each market is supported by a variety of applications such as sensors, radars, antenna in package, MEMS, GPS, power devices, controllers and motion systems for which weight, size, and power-saving are critical
iNPACK will be ready for full scale in Q3 2022. An option to support NPI on a small series scale and an option to support customers with a fully duplicated production line to increase capacity
Scheduling any production scale depends on materials and tooling availability, product maturity, and prioritization. In cases where all these challenges are met-prototypes can be ready within a minimum of 1-2 weeks