Inpack
PCB

iNPACK
Advanced Packaging Solutions

iNPACK is an advanced heterogeneous integration provider of System-in-Package (SiP) solutions.

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iNPACK’s expert offering includes an organic substrate and enhanced micro-electronics packaging technologies maximizing functionality, speed & efficiency in a reduced form factor.

iNPACK

Our All-in-One approach benefits our customers with SMT, substrate design and manufacturing, process design, testing, and excellent supply chain services. All under the same roof.

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As a subsidiary of PCB Technologies, we benefit from 40 years of experience in PCB design, manufacturing, and electronic assembly operation (EMS) and lead the way in new high-end heterogeneous integration SiP technology, and innovation.

 

Frequently Asked Questions

What are the common applications iNPACK is targeting?

System In Package is being applied in a variety of market industries such as automotive, defense, aerospace, medical electronics, energy, and communication, each market is supported by a variety of applications such as sensors, radars, antenna in package, MEMS, GPS, power devices, controllers and motion systems for which weight, size, and power-saving are critical

When will iNPACK start the ramp-up to mass production?

iNPACK will be ready for full scale in Q3 2022. An option to support NPI on a small series scale and an option to support customers with a fully duplicated production line to increase capacity

How long would it take to get a prototype?

Scheduling any production scale depends on materials and tooling availability, product maturity, and prioritization. In cases where all these challenges are met-prototypes can be ready within a minimum of 1-2 weeks